By Dongming Zhu, Hua-Tay Lin, Sanjay Mathur, Tatsuki Ohji
The current quantity comprises 16 contributed papers from the symposium, with issues together with complicated coating processing, complicated coating for put on, corrosion, and oxidation resistance, and thermal and mechanical houses, highlighting the cutting-edge ceramic coatings applied sciences for varied serious engineering functions.
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Extra resources for Advanced Ceramic Coatings and Interfaces V: Ceramic Engineering and Science Proceedings, Volume 31
Cooling these structures to 25°C produces an increase in these stresses to ~900 and ~200 MPa, respectively. In addition, cooling was found to have produced tensile tractions across the TGO/bond-coat interface of ~400 MPa for the rougher surfaces. This combination of results emphasises the importance of producing as flat a bond coat surface as feasible. The dependence of the various delamination mechanisms on surface roughness are only now being assessed quantitatively using realistic numerical models which allow for creep processes and the volume expansion due to oxide formation.
Figure 7 Measured damage evolution in APS TBC Fracture-mechanical modelling Figure 8 Idealised interface / crack geometry for the FM model In parallel with the described experimental investigation, a fracture-mechanical model has been set up. The model bases on an idealised (sinusoidal) BC/TC interface profile, in which the TGO is assumed to grow. See Fig. 8. 0, cracks extend along the whole interface, leading to complete failure. 0. Further essential model assumptions: • Plane strain. • The TBC system is assumed stress-free at the end of the high-temperature part of the cycle (high temperature gives rapid stress relaxation and relaxation of the misfit stress created by the TGO growth).
For the higher strain rate, IATJ = 397°C and for the lower strain rate, lATJ = 542°C. m"2, for the higher and lower cooling rates, respectively. These values are appreciably higher than the true work of adhesion and show the importance of creep relaxation in determining the growth kinetics of the interfacial cracks. They also show that Gc has no unique value but will vary with test conditions, in this example the cooling rate. Temperature Drop, °C Figure 3. Finite element computations of the kinetics of growth of a wedge crack along the alumina/Haynes 214 alloy interface during cooling from 1100°C at two cooling rates.